設施農業：節能栽培與滅菌【化學工程學系/陳志銘特聘教授】
| 論文篇名 | 英文：Surface composite engineering of polyimide to create amine functionalities for autocatalytic metallization 中文：以聚醯亞胺表面複合工程製作胺基官能化應用於自動催化金屬化 |
| 期刊名稱 | Applied Surface Science |
| 發表年份,卷數,起迄頁數 | 2021, 541, no.148500 |
| 作者 | Lai, Yi-Hsiang; Sil, Manik Chandra; Chen, Chih-Ming(陳志銘)* |
| DOI | 10.1016/j.apsusc.2020.148500 |
| 中文摘要 | 通過表面複合工程實現聚醯亞胺的自催化金屬化，是一種製造軟性印刷電路板的簡便方法。聚醯亞胺的表面複合工程包括通過電漿離子活化產生活性位點、與活性位點的共價鍵連接胺基封端的有機矽烷、與胺基團的反應吸附鈀催化劑、以及透過化學沉積鍍銅層的自催化金屬化。三種具有不同數量胺基的矽烷應用於矽烷化聚醯亞胺表面並產生胺官能團，成功實現銅沉積的高覆蓋率。標準的90°剝離試驗進一步表明，含一個胺基的矽烷在銅層的黏附性能上優於其他含兩個和三個胺基的矽烷，最高剝離強度達到0.8 kgf/cm。透過系統性的實驗和理論探索，了解三種氨基矽烷/聚醯亞胺複合體系在原子水平上的接枝結構，並研究與剝離強度性能的相關性。 |
| 英文摘要 | Autocatalytic metallization of polyimide (PI) is accomplished through surface composite engineering as a facile approach to fabricate flexible printed circuit boards. The surface composite engineering of PI involves the generation of active sites by plasma activation, attachment of amine-terminated organosilanes through covalent bonding with the active sites, adsorption of a palladium catalyst by a complex reaction with the amine groups, and electroless deposition of copper through autocatalytic metallization. Three aminosilanes with various numbers of amine units are employed to silanize the PI surface and to create amine functionalities, successfully achieving a high coverage of copper deposition. The standard 90° peeling test further identifies that the aminosilane with one amine unit outperforms the others with two and three amine units in the adhesion performance of the copper layer, with the highest peel strength reaching 0.8 kgf/cm. A systematic study is performed to experimentally and theoretically explore the grafting conformation of the three aminosilane/PI composite systems at the atomic level, and the correlation with the peel strength performance is also investigated. |
| 發表成果與本中心研究主題相關性 | 此一研究成果係開發前瞻軟板金屬化技術，可應用於各類新興軟性電子元件，增加元件可靠度。 |
