Facility Agriculture: Energy Saving and Sterilization【Department of Chemical Engineering / Chen, Chih-Ming / Distinguished Professor】
設施農業：節能栽培與滅菌【化學工程學系/陳志銘特聘教授】
論文篇名
英文：Influences of impurity incorporation in electroplated Cu on the SnAgCu and Ni-containing SnAgCu solder joints
中文：電鍍銅中雜質摻入對SnAgCu和含鎳SnAgCu銲點的影響
期刊名稱 JOURNAL OF THE ELECTROCHEMICAL SOCIETY
發表年份,卷數,起迄頁數 2022, 169, 052508
作者 Chen, Po-Kai; Li, Yu-Ju; Yen, Yee-Wen; Chen, Chih-Ming(陳志銘)*
DOI 10.1149/1945-7111/ac7105
中文摘要 SnAgCu 和含鎳 SnAgCu 合金廣泛應用於與Cu 連接以構成微電子銲點，電沉積是一種常用於製造銅的技術，但源自添加劑的有機雜質的共沉積是不可避免的可靠性問題。本研究調查雜質對在 200 °C 下熱老化的兩個銲點（SnAgCu/Cu 和 SnAgCu-Ni/Cu）中空洞生成傾向的影響。結果表明，高濃度的雜質摻入導致大量孔洞沿 SnAgCu/Cu 和 SnAgCu-Ni/Cu 界面傳播，通過精確控制添加劑配方來降低雜質濃度，可以減弱雜質效應，有效抑制孔洞擴展。雜質效應的減弱現象在 SnAgCu-Ni/Cu 接點中更為明顯，顯示透過Ni添加抑制Cu3Sn以及Kirkendall 孔洞的生長也有助於減少雜質的影響。
英文摘要 SnAgCu and Ni-containing SnAgCu alloys are Pb-free solders widely used to join with Cu to construct the solder joints. Electrodeposition is a technology commonly used to fabricate Cu but co-deposition of organic impurities originating from additives is an inevitable reliability issue. This study investigates the impurity effect on the voiding propensity in the two solder joints (SnAgCu/Cu and SnAgCu-Ni/Cu) subjected to thermal aging at 200 °C. Results show that a high level of impurity incorporation causes massive void propagation along the SnAgCu/Cu and SnAgCu-Ni/Cu interface. Reduction of the impurity concentration by precise control of the additive formulas can weaken the impurity effect and effectively suppress the void propagation. The weakening phenomenon of the impurity effect is more pronounced in the SnAgCu-Ni/Cu joint, indicating that suppression of the Cu3Sn growth as well as Kirkendall voids by Ni addition is also helpful in reducing the influences of impurities.
發表成果與本中心研究主題相關性 透過合金改質可有效降低雜質對於微電子銲點的影響，提升銲點可靠度。