設施農業：綠能設施開發【材料科學與工程學系宋振銘教授】
| 論文篇名 | 英文：Plasma-Modified PI Substrate for Highly Reliable Laser-Sintered Copper Films Using Cu2O 中文： 以Cu2O在電漿改質高分子基板上製作高可靠度雷射燒結銅膜 |
| 期刊名稱 | NANOMATERIALS |
| 發表年份,卷數,起迄頁數 | 2022, 12, 3237 |
| 作者 | Cheng, Wei-Han; Lee, Ming-Tsang; Yasuda, Kiyokazu; Song, Jenn-Ming(宋振銘)* |
| DOI | 10.3390/nano12183237 |
| 中文摘要 | 本研究開發於電漿改質PI基板上雷射燒結奈米Cu2O粒子為導電線路。PI基板之表面性質以AFM、XPS與接觸角量測進行。實驗顯示，PI基板表面能、粗糙度以及表面官能基鍵結均對銅燒結組織機械可靠度產生影響。在測試的電漿氣體當中，氧氣電漿除了粗糙化表面並產生最多的C=O 與C-OH表面鍵結以及極性表面能，此綜合效應導致最佳之彎曲疲勞阻抗。 |
| 英文摘要 | Plasma modification of polyimide (PI) substrates upon which electrical circuits will be fabricated by the laser sintering of cuprous oxide nanoparticle pastes was investigated systematically in this study. Surface properties of the PI substrate were investigated by carrying out atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS), and contact angle measurements. Experimental results show that surface characteristics of PI substrates, including surface energy, surface roughness and surface binding, significantly affected the mechanical reliability of the sintered copper structure. Among the plasma gases tested (air, O2, Ar-5%H2, and N2-30%H2), O2 plasma caused the roughest PI surface as well as the most C=O and C–OH surface binding resulting in an increased polar component of the surface energy. The combination of all those factors gave rise to a superior bending fatigue resistance. |
| 發表成果與本中心研究主題相關性 | 應用於農牧場發電/儲能元件之可撓線路製作 |
