設施農業：綠能設施開發【材料系宋振銘教授】
論文篇名 英文：Interconnect Fabrication on Polymer Substrate using Submicron/Nano Silver Particles with the Assistance of Low-Density Irradiations
中文：
期刊名稱 JOM
發表年份,卷數,起迄頁數 2019,71(9),3057-3065
作者 Huang, Guo-Lun;Chiu, Po-Hsiang;Fujino, Masahisa;Song, Jenn-Ming*(宋振銘)
DOI 10.1007/s11837-019-03595-5
中文摘要  
英文摘要 Low-energy Xenon flash pulses permit sintering of spray-pyrolyzed submicron Ag particles (SMPs) into conductive tracks with acceptable electrical resistivity (16.7 lX cm) on polyimide film in several seconds without extra heating. Mixed with Ag nanoparticles (20% in weight ratio), the resistivity of the obtained sintered mixed pastes can be reduced to 12.6 lX cm, which is nearly the same as those formed using nanoparticle pastes (11.2 lX cm). Using irradiation on the polymer substrate side, more uniform sintered deposits with better electrical conductance (q< 10 lX cm) and greater bending fatigue resistance could be achieved. This sheds light on a new method for preparing low-cost, bendable Ag interconnections.