Surface modification of Cu electroplated layers for Cu-Sn transient liquid phase bonding | IDCSA, NCHU

Surface modification of Cu electroplated layers for Cu-Sn transient liquid phase bonding 2021-12-16

Facility Agriculture: Energy Saving and Sterilization【Department of Chemical Engineering / Chen, Chih-Ming / Distinguished Professor】
設施農業：節能栽培與滅菌【化學工程學系/陳志銘特聘教授】

論文篇名	英文：Surface modification of Cu electroplated layers for Cu-Sn transient liquid phase bonding 中文：銅電鍍層的表面改性應用於銅/錫瞬態液相接合
期刊名稱	MATERIALS CHEMISTRY AND PHYSICS
發表年份,卷數,起迄頁數	2022, 277, 125621
作者	Hsu, Shao-Yu; *Chen, Chih-Ming(陳志銘); Song, Jenn-Ming(宋振銘**); Nishikawa, Hiroshi
DOI	10.1016/j.matchemphys.2021.125621
中文摘要	瞬態液相接合技術引起極大的關注，因為可以產生高溫應用的全介金屬化合物接合結構。在本研究中，基於 Cu/Sn-3.5 wt% Ag/Cu 的夾層結構在 260 °C 熱壓 20 分鐘後的微觀結構和力學分析，研究Cu-Sn瞬態液相接合。電鍍用於製備具有各種表面結構的銅基體，以研究形貌對瞬態液相接合技術的影響。微觀結構分析表明，兩種介金屬化合物Cu₆Sn₅和Cu₃Sn在接合界面處形成。剪切強度測試表明，與普通多面銅相比，具有圓拱頂和階梯金字塔形表面結構的銅基材有利於瞬態液相接合，並提高剪切強度。剪切強度的提高歸因於銅圓頂和棱錐的鉚接和互鎖作用，阻礙斷裂的擴展。
英文摘要	Transient liquid phase (TLP) bonding technology attracts great attention as it can produce a full intermetallic compound (IMC) bonding structure for high-temperature applications. In this study, the Cu–Sn TLP bonding is investigated based on the microstructural and mechanical analyses of a sandwiched structure of Cu/Sn-3.5 wt% Ag/Cu under thermal compression at 260 °C for 20 min. Electroplating is used to prepare the Cu base with various surface structures to investigate the topographical effect on the TLP bonding technology. The microstructural analysis indicates that two IMCs, Cu6Sn5 and Cu3Sn, are formed at the bonding interface. The shear strength test shows that the Cu base with a dome and step pyramid shaped surface structure benefits the TLP bonding and increases the shear strength as compared to common faceted Cu base. The improvement of shear strength is attributed to the riveting and interlocking effect of the Cu domes and pyramids which disadvantages the propagation of fracture.
發表成果與本中心研究主題相關性	開發特殊表面形貌的銅基材，應用於瞬態液相接合技術，提升接合強度。