Interfacial reactions between pure indium solder and Au/Ni metallization | IDCSA, NCHU

Interfacial reactions between pure indium solder and Au/Ni metallization 2022-05-02

Facility Agriculture: Energy Saving and Sterilization【Department of Chemical Engineering / Chen, Chih-Ming / Distinguished Professor】
設施農業：節能栽培與滅菌【化學工程學系/陳志銘特聘教授】

論文篇名	英文：Interfacial reactions between pure indium solder and Au/Ni metallization 中文：純銦銲料與金/鎳金屬層之界面反應
期刊名稱	JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
發表年份,卷數,起迄頁數	2022, 33, 13143–13151
作者	Huang, Li-Chi; Zhang, Yan-Ping; Chen, Chih-Ming(陳志銘)*; Hung, Liang-Yih; Wang, Yu-Po
DOI	10.1007/s10854-022-08253-2
中文摘要	隨著高性能微電子封裝結構體對高效散熱的需求不斷增加，熱界面材料引起廣泛關注。由於高導熱性，純銦是一種很有前途的熱界面材料。兩個相鄰組件之間的熱界面材料是通過相鄰表面上的銦和 Au/Ni 金屬化層之間的固液互擴散反應所建構。了解 In/Au/Ni 界面處介金屬化合物的形成與生長動力學對於熱界面材料的可靠性評估至關重要。在本研究中，分別研究固液互擴散和熱老化過程中銦和 Au/Ni 在 220-260 °C 和 100-150 °C 下的界面反應。金相分析表明，薄金層迅速溶解到熔融銦基體中，在固液互擴散和時效反應中在 In/Ni 界面處僅留下一個介金屬化合物。成分和晶體學分析證實該介金屬化合物是 Ni₂₈In₇₂摻入少量的 Au 溶解。Ni₂₈In₇₂的厚度演變與反應時間的平方根呈線性關係，表明為擴散控制的生長行為。
英文摘要	Thermal interface material (TIM) attracts considerable attention as the increasing demands for efficient heat dissipation in high-performance microelectronic packages. Due to high thermal conductivity, pure indium is a promising candidate of TIM. The TIM joint between two adjoining components is constructed by solid–liquid interdiffusion (SLID) reaction between indium and Au/Ni metallization on the adjoining surfaces. An understanding of the formation and growth kinetics of the intermetallic compounds (IMCs) at the In/Au/Ni interface is crucial for the reliability assessment of the TIM joints. In this study, the interfacial reactions between indium and Au/Ni in the SLID and thermal aging processes at 220–260 °C and 100–150 °C, respectively, are investigated. The metallographic analysis indicates that the thin Au layer dissolves rapidly into the molten indium matrix, leaving only one IMC at the In/Ni interface in the SLID and aging reactions. Compositional and crystallographic analyses both confirm that the IMC is Ni28In72 incorporated with a small amount of Au solubility. The thickness evolution of Ni28In72 displays a linear relationship with the square root of reaction time, indicating a diffusion-controlled growth behavior.
發表成果與本中心研究主題相關性	探討純銦銲點的反應動力學，了解純銦作為熱界面材料的可行性。