Facility Agriculture: Energy Saving and Sterilization【Department of Chemical Engineering / Chen, Chih-Ming / Distinguished Professor】
設施農業：節能栽培與滅菌【化學工程學系/陳志銘特聘教授】
論文篇名 英文：Intermetallic compound formation and growth behavior at the interface between indium and Au/Ni(V) metallization
中文：銦和 Au/Ni(V) 金屬層界面介金屬化合物的形成和生長行為
期刊名稱 MATERIALS CHARACTERIZATION
發表年份,卷數,起迄頁數 2022, 184, 111673
作者 Huang, Li-Chi; Zhang, Yan-Ping; Chen, Chih-Ming(陳志銘)*; Hung, Liang-Yih; Wang, Yu-Po
DOI 10.1016/j.matchar.2021.111673
中文摘要 純銦銲料有望應用為高效散熱的熱界面材料與低溫連接的無鉛銲料。在本研究中，研究矽晶片上 In 和 Au/Ni(V) 表面處理之間的液/固和固/固反應，探索在 In/Au/Ni(V) 處形成的介金屬化合物及其生長動力學。兩種介金屬化合物 (Ni,Au)28In72和 Ni-V-In，分別在 220–260 °C 和 100–150 °C 下進行的液/固和固/固反應的界面處形成。(Ni,Au)28In72的生長遵循拋物線規律，由於Ni的向外擴散和In的向內擴散，原始Ni（V）的相變形成Ni-V-In非晶相。此種相變在液/固反應中以更快的速度進行，一旦 Ni(V) 完全轉變為 Ni-V-In 相，Ni 供應就會耗盡，從而加速(Ni,Au)28In72的熟化反應及其散裂到熔融 In 基體中。
英文摘要 Pure indium (In) solder is promising as the thermal interface material (TIM) for efficient heat dissipation and as the Pb-free solder for cryogenic joining applications. In this study, liquid/solid and solid/solid reactions between In and Au/Ni(V) surface finish on a Si chip are investigated to explore the formation of intermetallic compounds (IMCs) formed at the In/Au/Ni(V) interface and their growth kinetics. Two IMCs, (Ni,Au)28In72 and Ni-V-In, are formed at the interface in the liquid/solid and solid/solid reactions performed at 220–260 °C and 100–150 °C, respectively. The growth of the (Ni,Au)28In72 crystalline phase follows the parabolic law and the underlying Ni-V-In amorphous phase is formed as a result of phase transformation from original Ni(V) due to outward diffusion of Ni and inward diffusion of In. This phase transformation proceeds at a faster rate in the liquid/solid reaction. The Ni supply is exhausted once the Ni(V) is completely transformed into the Ni-V-In phase, accelerating the ripening reaction of (Ni,Au)28In72 and its spallation into the molten In matrix.
發表成果與本中心研究主題相關性 探討純銦銲料應用為高效散熱的熱界面材料與低溫連接材料的可行性。