設施農業：農業綠能開發與碳匯補償【化學工程學系陳志銘 特聘教授】
| 論文篇名 | 英文：Strong grain size effect on the liquid/solid reactions between molten solder and electroplated Cu 中文：晶粒尺寸對熔融銲料和電鍍銅之間液/固反應的強烈影響 |
| 期刊名稱 | Materials Today Communications |
| 發表年份,卷數,起迄頁數 | 2024, 41, 110236 |
| 作者 | Huang, Pin-Yu; Chung, Man-Hsuan; Jhan, Jhih-Jhu; Hwang, Byungil; Chen, Chih-Ming(陳志銘)* |
| DOI | 10.1016/j.mtcomm.2024.110236 |
| 中文摘要 | 銅金屬化的電沉積及其與銲料合金的焊接反應在微電子封裝工業中具有重要的技術意義。本研究旨在研究 Cu 晶粒尺寸對熔融 Sn-3 wt% Ag-0.5 wt% Cu (SAC305) 銲錫合金與電鍍 Cu 之間液/固反應的影響。製備兩種銅電鍍膜，分別稱為細晶銅 (FG-Cu) 和粗晶銅 (CG-Cu)，並與 SAC305 在 260 ℃ 下反應 5-20 分鐘。微觀結構表徵表明，Cu6Sn5 介金屬化合物在這兩個銲點中形成，而 FG-Cu 銲點中的 IMC 生長速度比 CG-Cu 銲點中的生長速度更快。 FG-Cu 銲點中的 Cu6Sn5 IMC 呈現出細長的柱狀晶粒形態，與 CG-Cu 焊點中常見的扇貝狀晶粒形態不同。透過比較熟化和界面反應兩種通量對 Cu6Sn5 生長的貢獻，合理化解釋強烈的晶粒尺寸效應。 |
| 英文摘要 | Electrodeposition of Cu metallization and its soldering reaction with solder alloy are of technological significance in microelectronic packaging industry. This study aims to investigate the effect of Cu grain size on the liquid/solid reactions between molten Sn-3 wt% Ag-0.5 wt% Cu (SAC305) solder alloy and electroplated Cu. Two Cu electroplated films, denominated as fine-grained Cu (FG-Cu) and coarse-grained Cu (CG-Cu), are prepared and reacted with SAC305 at 260 ◦C for 5–20 min. Microstructural characterization shows that the Cu6Sn5 intermetallic compound (IMC) is formed in these two solder joints, while that in the FG-Cu solder joint grows at a faster rate than that in the CG-Cu solder joints. The Cu6Sn5 IMC in the FG-Cu solder joint exhibits a slender column-like grain morphology, unlike the common scallop-like grain morphology in the CG-Cu solder joints. The strong grain size effect is rationalized by comparing the contribution of two fluxes of ripening and interfacial reaction to the growth of Cu6Sn5. |
| 發表成果與本中心研究主題相關性 | 封裝銲點存在於各種能源元件與設備之中，了解銲點接合反應有助於改善元件的運作效能與信賴性。 |
