設施農業：綠能設施開發【材料系宋振銘教授】
論文篇名 英文：Nanomechanical Responses of Intermetallic Compound Layer in Transient Liquid Phase Bonding Using Indium
中文：
期刊名稱 Journal of ELECTRONIC MATERIALS
發表年份,卷數,起迄頁數 2019,ONLINE
作者 Song, Jenn-Ming *(宋振銘);Lu, Wei-Chih;Chou, Pei-Wen
DOI 10.1007/s11664-019-07758-7
中文摘要  
英文摘要 Low-temperature transient liquid phase bonding (TLPB) can be achieved using indium, and the joints thus formed can withstand high temperatures. Since the joints that are formed with TLPB entirely consist of intermetallic compounds (IMCs), this study investigates the phase evolution and mechanical properties of IMCs that are obtained from isothermal reactions between In and commonly used substrate metals, Cu, Ag and Au. Using nanoindentation, the relationships between the yield strain, work hardening exponent and strain rate sensitivity of In-bearing and other frequently observed IMC phases were compared. Notably, the strain-induced precipitation of Ag3In occurred in the indent of Ag9In4.