設施農業：節能栽培與滅菌【化學工程學系/陳志銘特聘教授】
| 論文篇名 | 英文：Surface Silanization of Polyimide for Autocatalytic Metallization 中文：聚醯亞胺之表面矽烷化應用於自催化之金屬化 |
| 期刊名稱 | JOM |
| 發表年份,卷數,起迄頁數 | 2020, in press |
| 作者 | Liu, Jun-Nan; Sil, Manik Chandra; Cheng, Rui; Feng, Shien-Ping; Chen, Chih-Ming(陳志銘)* |
| DOI | 10.1007/s11837-020-04286-2 |
| 中文摘要 | 由於優異的化學穩定性、機械強度、重量輕和柔韌性，聚醯亞胺已被廣泛應用於柔性印刷電路板如柔性覆銅層壓板的高分子基材。在全球化5G消費電子產品中，開發一種無黏性雙層結構是勢在必行。本研究以矽烷接枝聚醯亞胺薄膜為基材，進行自催化金屬化製備高品質的銅/聚醯亞胺基板。使用末端胺有機矽烷對聚醯亞胺進行官能化，負載聚乙烯吡咯烷酮封端鈀奈米團簇作為催化劑。本文章系統性研究具有不同胺官能團數目的有機矽烷對催化劑的吸附及金屬化的影響。經過對聚醯亞胺薄膜進行矽烷化前後的表面綜合表徵，結果表明，帶有三個胺基的有機矽烷的性能優於帶有一個胺基的有機矽烷，催化劑吸附增加四倍，也提高了金屬化效率。 |
| 英文摘要 | Due to its superior chemical stability, mechanical strength, light weight, and flexibility, polyimide (PI) has been widely used as a polymeric substrate of flexible printed circuit boards such as flexible copper clad laminates (FCCLs). The development of an adhesiveless dual-layer structure is imperative for the application of FCCLs in globalized 5G consumer electronics. In this work, autocatalytic metallization on a silane-grafted PI film was developed to fabricate a high-quality Cu/PI substrate. PI was functionalized by amine-terminated organosilanes to load polyvinylpyrrolidone-capped Pd nanoclusters (PVP-nPd) as a catalyst. The effects of organosilanes with different numbers of amine functional groups on the adsorption of the PVP-nPd catalyst and the subsequent metallization of Cu were systematically investigated. Comprehensive surface characterizations were carried out on the PI films before and after silanization. The organosilane bearing three amine groups was found to outperform its counterpart with one amine group, exhibiting a fourfold increase in catalyst adsorption, which also improved the metallization efficiency. |
