【學術亮點】Interfacial reaction and thermomigration of copper/indium joints
Facility Agricultural: Green Energy Development and Carbon Offset【Department of Chemical Engineering / Chen, Chih-Ming/ Distinguished Professor】
設施農業：農業綠能開發與碳匯補償【化學工程學系陳志銘 特聘教授】
| 論文篇名 | 英文：Interfacial reaction and thermomigration of copper/indium joints 中文：銅/銦接點的界面反應與熱遷移 |
| 期刊名稱 | Journal of Materials Research and Technology |
| 發表年份,卷數,起迄頁數 | 2025, 34, 2051-2059 |
| 作者 | Huang, Zi-Yu; Chu, Yen-Ju; Ho, Cheng-En; Shen, Yu-An; Chen, Chih-Ming(陳志銘)* |
| DOI | 10.1016/j.jmrt.2024.12.227 |
| 中文摘要 | 銦是一種很有前途的連接材料，用於低溫焊接和熱界面應用。銅是用於連接銦以形成銲點的常見金屬墊。界面反應和熱遷移是銲點可靠度評估的兩個重要研究主題。本文針對在 210 °C 下退火的銅/銦接頭的界面反應進行研究，重點研究接點處形成的介金屬化合物的生長動力學。透過熱壓製備夾層銅/銦/銅接點，研究在 794 °C cm−1 的溫度梯度驅動下接點的熱遷移行為。結果表明，在銅/銦接頭處形成了 Cu11In9 相，其生長速率受電鍍銅基板的雜質含量和晶粒尺寸的影響。熱遷移效應在銅/銦/銅接點中表現顯著，其中冷端Cu11In9相的生長速度遠快於熱端。計算出銅在熔融銦中的擴散率與摩爾遷移熱的平均乘積為（3.09±0.21）×10−2 J·cm²·mol−1·s−1。 |
| 英文摘要 | Indium is a promising joining material for low-temperature soldering and thermal interface applications. Copper is a common metal pad used to join indium to form solder joints. Interfacial reactions and thermomigration are two important research subjects for the reliability assessment of solder joints. In this study, the interfacial reactions of copper/indium joints annealed at 210 °C are investigated with a focus on the growth kinetics of intermetallic compounds (IMCs) formed at the joints. Sandwiched copper/indium/copper joints are prepared via thermocompression to study the thermomigration across the joint driven by a temperature gradient of 794 °C cm−1. The results show that the Cu11In9 phase forms at the copper/indium joints, whereas its growth rate is influenced by the impurity content and grain size of the electroplated copper substrates. The thermomigration effect is significant in copper/indium/copper joints, wherein the Cu11In9 phase at the cold end grows at a much faster rate than does that at the hot end. The average product of the diffusivity and molar heat of transport (D × Q∗) for copper in molten indium is calculated to be (3.09 ± 0.21) × 10−2 J cm2 mol−1 s−1. |
| 發表成果與本中心研究主題相關性 | 封裝銲點存在於各式能源元件與設備之中，了解接點性能有助於改善元件的運作效能與信賴性。 |
