【學術亮點】Effect of Bi Addition on Melting Behavior, Solder Joint Strength, and Thermal Aging Resistance of Sn-3.5Ag/Cu Joints
Facility Agricultural: Green Energy Development and Carbon Offset【Department of Chemical Engineering / Chen, Chih-Ming/ Distinguished Professor】
設施農業：農業綠能開發與碳匯補償【化學工程學系陳志銘 特聘教授】
| 論文篇名 | 英文：Effect of Bi Addition on Melting Behavior, Solder Joint Strength, and Thermal Aging Resistance of Sn-3.5Ag/Cu Joints 中文：鉍添加對錫-3.5銀/銅銲點熔化行為、銲點強度及抗熱老化性能的影響 |
| 期刊名稱 | JOM |
| 發表年份,卷數,起迄頁數 | 2025, 77, 4206–4214 |
| 作者 | Shen, Yu-An; Chen, Fang-Yu; Gao, Ruhuna; Ho, Cheng-En; Nishikawa, Hiroshi; Chen, Chih-Ming(陳志銘)* |
| DOI | 10.1007/s11837-025-07268-4 |
| 中文摘要 | 研究表明在錫-3.5銀銲料合金中添加鉍可有效降低熔點並提高銲點強度，即使在延長熱老化處理時間後依然如此。加入5 wt.% 鉍的錫-銀銲料的起始熔點為198.6 °C，遠低於錫-銀銲料的起始熔點（219.8 °C）。此外，加入5 wt.% 鉍的錫-銀銲料在熱老化後還會引起顯著的微觀結構變化，包括鉍的析出和均勻彌散，從而提供沉澱強化和彌散強化。同時，部分鉍溶質可以透過固溶強化來增強錫基體。雖然鉍的添加加速老化過程中介金屬化合物的生長，但加入5 wt.% 鉍的錫-銀銲料合金固有強度的提高彌補這一影響，確保了良好的焊接強度（66 MPa）和熱穩定性。這些結果證明鉍對錫-銀銲料合金在低溫可靠電子封裝應用中表現的影響。 |
| 英文摘要 | This study demonstrates that the addition of Bi to Sn-3.5Ag (SA) solder alloys effectively reduces the melting temperature and enhances the solder joint strength, even after prolonging the thermal aging treatment. The onset melting temperature of SA with 5 wt.% Bi (SAB5) was 198.6°C, which is much lower than that of SA (219.8°C). Furthermore, SAB5 would also lead to notable microstructural changes, including Bi precipitation and uniform dispersion after thermal aging, which provides precipitation and dispersion strengthening. Simultaneously, partial Bi solutes could reinforce the Sn matrix by solid-solution strengthening. Although Bi addition accelerated the growth of intermetallic compound (IMC) during aging, the increased intrinsic strength of the SAB5 alloy compensated for this effect, ensuring good soldering strength (66 MPa) and thermal stability. These results demonstrate the effect of Bi on the properties of the SA alloy for low-temperature and reliable electronic packaging applications. |
| 發表成果與本中心研究主題相關性 | 封裝銲點存在於各式能源元件與設備之中，了解銲點性能有助於改善元件的運作效能與信賴性。 |
