【學術亮點】採用錫/鉍電沉積雙層進行低溫焊接
【學術亮點】Low-temperature soldering using Sn/Bi electrodeposited bilayer
Facility Agricultural: Green Energy Development and Carbon Offset【Department of Chemical Engineering / Chen, Chih-Ming/ Distinguished Professor】
設施農業：農業綠能開發與碳匯補償【化學工程學系陳志銘 特聘教授】
論文篇名 英文：Low-temperature soldering using Sn/Bi electrodeposited bilayer
中文：採用錫/鉍電沉積雙層進行低溫焊接
期刊名稱 Materials Science in Semiconductor Processing
發表年份,卷數,起迄頁數 2025, 186, no.109056
作者 Wang, Wei-Li; Cherng, Sheng-Jye; Huang, Yu-Ting; Gao, Runhua; Tatsumi, Hiroaki; Nishikawa, Hiroshi; Chen, Chih-Ming(陳志銘)*
DOI 10.1016/j.mssp.2024.109056
中文摘要 低溫焊接是近年來備受關注的連接技術，因其在節能減碳方面的潛力而備受關注。共晶錫鉍合金是一種常見的低溫銲料。由於錫和鉍的還原電位差異較大，採用低成本電沉積製備材料有成分控制問題。本研究採用電沉積方法來製備錫/鉍雙層結構，並詳細研究其在熱退火條件下的微觀結構演變，以評估替代共晶錫鉍合金的潛力。結果表明，在180 ℃加熱僅5 s的錫/鉍雙層結構中，界面液化迅速發生，30 s後雙層結構完全轉變為類共晶結構。透過相圖和電子顯微鏡觀察，建立微觀結構演變歷史。剪切試驗結果表明，類共晶結構具有與商用共晶錫鉍銲膏相當的良好機械性能。快速相變特性和高剪切強度使錫/鉍雙層結構成為低溫連接應用的有希望的候選材料。
英文摘要 Low-temperature soldering is a joining technology that attracts considerable attention in recent years due to its potential in energy saving and carbon reduction. Eutectic SnBi alloy is a common low-temperature solder. The material manufacturing using cost-effective electrodeposition suffers from composition control problem caused by very different reduction potentials between Sn and Bi. In this study, a Sn/Bi bilayer structure is constructed using electrodeposition and the microstructural evolution under thermal annealing is investigated in detail to evaluate its potential in replacement of eutectic SnBi alloy. Results show that interfacial liquation occurs rapidly in the Sn/Bi bilayer structure heated at 180 °C for only 5 s, and the bilayer structure completely transforms into a eutectic-like structure after 30 s. The microstructural evolution history is established with the help of phase diagram and electron microscopy examination. Shear test results indicate that the eutectic-like structure exhibits good mechanical property comparable to commercial eutectic SnBi solder paste. The rapid phase transformation feature and high shear strength make the Sn/Bi bilayer structure a promising candidate for low-temperature joining applications.
發表成果與本中心研究主題相關性 封裝銲點存在於各式能源元件與設備之中，發展新式接合材料有助於改善元件的運作效能與信賴性。