設施農業：節能栽培與滅菌【化工系陳志銘特聘教授】
論文篇名 英文：Influence of additives on electroplated copper films and their solder joints
中文：添加劑對電鍍銅膜及其銲點的影響
期刊名稱 Materials Characterization
 
發表年份,卷數,起迄頁數 2019, Vol. 147, pp. 57-63
作者 Hsuan Lee, Shan-Ting Tsai, Ping-Heng Wu, Wei-Ping Dow, Chih-Ming Chen
DOI 10.1016/j.matchar.2018.10.029
中文摘要 以有機硫化物3‑(2‑benzthiazolylthio)‑1‑propanesulfonsäure（ZPS）作為加速劑，並與抑制劑（polyethylene glycol,PEG）和氯離子（Cl-）在含電解質（硫酸銅和硫酸）的鍍銅溶液中製備銅膜。利用聚焦離子束、掃描式電子顯微鏡和電子背散射繞射對鍍銅薄膜的微觀結構進行觀察，發現ZPS濃度的增加會加速了鍍銅薄膜的晶粒增長。飛行式二次離子質譜的雜質檢測顯示，此種微觀結構的演變有效抑制鍍銅膜中雜質的摻入。高濃度ZPS對雜質摻入的抑制，以及對熱老化鍍銅銲點的結構穩定性和完整性具有重要作用。
英文摘要 An organosulfide, 3‑(2‑benzthiazolylthio)‑1‑propanesulfonsäure (ZPS), is used as an accelerator and formulated with a suppressor (polyethylene glycol, PEG) and chloride ions (Cl−) in the copper plating solution containing electrolytes (Cu sulfate and sulfuric acid) to prepare the Cu films. Microstructural characterization using focus ion beam (FIB), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) reveals that an increase of the ZPS concentration accelerates the grain growth of the electroplated Cu films. Impurity examination based on time-of-flight secondary ion mass spectrometer (TOF-SIMS) shows that such microstructural evolution effectively suppresses the impurity incorporation in the electroplated Cu films. The suppression effect on impurity incorporation by using a high level of ZPS concentration plays an important role in retaining the microstructural stability and integrity of the electroplated Cu solder joints subjected to thermal aging.