設施農業：光能設施於農業固碳之應用【材料科學與工程學系/宋振銘 教授】
| 論文篇名 | 英文：Microstructural Effects of Copper Deposits on Direct Bonding for 3D IC Integration 中文：銅沉積物對 3D IC 整合直接鍵結的微觀結構影響 |
| 期刊名稱 | Journal of Materials Research and Technology |
| 發表年份,卷數,起迄頁數 | 2024, 28, 1657-1666 |
| 作者 | Xie, Zong-Yu; Huang, Po-Kai; Lu, Yin-Chi; Kao, Golden; Hung, Chih-Pin; Yasuda, Kiyokazu; Song, Jenn-Ming(宋振銘)* |
| DOI | 10.1016/j.jmrt.2023.12.039 |
| 中文摘要 | Cu-to-Cu直接鍵結已被認為是實現三維積體電路整合的重要途徑。本研究旨在研究微觀結構和氙閃光暴露對銅沉積物直接結合的影響。製備具有不同晶粒尺寸、優選取向以及表面硬度的銅電沉積物以及濺鍍沉積物，以定量地闡明各個因素的影響。實驗結果表明，無論其他微觀結構差異如何，接頭強度和晶界密度都遵循正線性關係，這表明晶界擴散的主導作用。晶粒細化可以有效提高接合強度，即使直接接合接頭僅一側具有細晶粒。考慮到便攜式設備應用可能遭受跌落衝擊，首次對矽晶片上濺射銅與Al2O3基板上電鍍銅透過熱壓接合組裝而成的封裝進行跌落測試。值得注意的是，鍵合前進行適當的閃光照射不僅可以顯著提高剪切強度高達 60%，還可以提高直接銅鍵合的抗跌落性。直接黏合的菊花鏈在黏合前經過適當的光照，其抗跌落衝擊能力優於使用耐衝擊焊料黏合的接頭。 |
| 英文摘要 | Cu-to-Cu direct bonding has been regarded as an important approach to achieve three-dimensional integrated circuit integration. This study aims to investigate the effects of microstructure and Xenon flash exposure on the direct bonding of copper deposits. Copper electrodeposits, along with a sputtered deposit, with various grain sizes, preferred orientations, as well as surface hardnesses, were prepared to clarify the influence of individual factors quantitatively. Experimental results show that joint strength and grain boundary density followed a positively linear relationship regardless of other microstructural differences, suggesting the dominating role of grain boundary diffusion. Grain refinement can effectively enhance bonding strength, even only one side of the directly bonded joints possessed fine grains. Considering the portable device applications which may suffer from drop shocks, drop testing of the packages comprising sputtered copper on Si chips joined with electroplated copper on Al2O3 substrates assembled by thermal compression bonding was performed for the first time. Noticeably, a proper flash irradiaiton prior to bonding brought about not only remarkable improvement in shear strength by up to 60 % but also drop resistance for direct-copper bonds. The resistance against drop shock for directly-bonded daisy chains subjected to an appropriate light exposure prior to bonding was superior than the joints bonded using impact-resistant solders. |
